STIFF: Thermally Safe Temperature Effect Inversion Aware FinFET based Multi-core

Shounak Chakraborty, Vassos Soteriou, Magnus Själander

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

FinFET, a non-planar device, has become the prevalent choice for chip-multiprocessor (CMP) designs due to its lower leakage and improved scalability as compared to planar CMOS devices. FinFETs are fundamentally different from conventional CMOS circuits in terms of circuit-delay vs. temperature, i.e., circuit-delay decreases in FinFET at higher temperature even in the super threshold supply-voltage regime. Such characteristic of FinFET is known as temperature effect inversion (TEI). But, a drastic increase in channel temperature may lead to an increase in leakage consumption and may accelerate the circuit aging process due to the self-heating effect (SHE). This paper introduces STIFF, which balances the upsides of TEI against the potential hazardous SHE in a FinFET based CMP. Basically, STIFF exploits online performance statistics to determine the thermal intensity of cores and local caches, and scales the supply-voltage prudentially to maintain a stable core-frequency and local-cache performance on-the-fly by exploiting TEI, while reducing the SHE. Our simulation results show that, STIFF is able to maintain a stable frequency of 3.7GHz of the cores with a small standard deviation of 0.23, while maintaining a safe temperature during execution, and it outperforms a state-of-the-art DVFS technique for the FinFET based cores. STIFF also maintains a stable access time at the local L1 caches, while ensuring thermal safety by introducing a cache access cognizant scaling of the supply voltage of the individual L1 cache-banks without any noticeable performance-loss.

Original languageEnglish (US)
Title of host publicationProceedings of the 19th ACM International Conference on Computing Frontiers 2022, CF 2022
PublisherAssociation for Computing Machinery
Pages21-29
Number of pages9
ISBN (Electronic)9781450393386
DOIs
StatePublished - May 17 2022
Event19th ACM International Conference on Computing Frontiers, CF 2022 - Turin, Italy
Duration: May 17 2022May 19 2022

Publication series

NameACM International Conference Proceeding Series

Conference

Conference19th ACM International Conference on Computing Frontiers, CF 2022
Country/TerritoryItaly
CityTurin
Period5/17/225/19/22

Keywords

  • CMP
  • FinFET
  • SHE
  • TEI
  • thermal management

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Computer Networks and Communications
  • Computer Vision and Pattern Recognition
  • Software

Fingerprint

Dive into the research topics of 'STIFF: Thermally Safe Temperature Effect Inversion Aware FinFET based Multi-core'. Together they form a unique fingerprint.

Cite this