Abstract
DC reactive sputter deposition of dielectrics can be done using dc power pulsed in the range of 5-350 kHz. Although pulsed dc reactive sputtering (PDRS) does not solve the disappearing anode problem, it provides a deposition process without arcing. Pulsing plasma creates unusual conditions at the substrate, and requires a special approach to biasing. In this work, plasma properties, as well as substrate effects under various biasing conditions, were investigated. Deposition of alumina is used as an example of PDRS.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings, Annual Technical Conference - Society of Vacuum Coaters |
| Pages | 114-119 |
| Number of pages | 6 |
| State | Published - 2003 |
| Event | 46th Annual Technical Conference Proceedings - San Francisco, CA, United States Duration: May 3 2003 → May 8 2003 |
Other
| Other | 46th Annual Technical Conference Proceedings |
|---|---|
| Country/Territory | United States |
| City | San Francisco, CA |
| Period | 5/3/03 → 5/8/03 |
Keywords
- Dielectrics
- Pulse bias
- Pulse power
- Reactive sputtering
ASJC Scopus subject areas
- Mechanical Engineering
- Surfaces and Interfaces
- Fluid Flow and Transfer Processes
- Surfaces, Coatings and Films