Substrate Biasing in Pulsed DC Reactive Sputtering of Dielectrics

A. Freilich, A. Belkind, K. Becker, J. Lopez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

DC reactive sputter deposition of dielectrics can be done using dc power pulsed in the range of 5-350 kHz. Although pulsed dc reactive sputtering (PDRS) does not solve the disappearing anode problem, it provides a deposition process without arcing. Pulsing plasma creates unusual conditions at the substrate, and requires a special approach to biasing. In this work, plasma properties, as well as substrate effects under various biasing conditions, were investigated. Deposition of alumina is used as an example of PDRS.

Original languageEnglish (US)
Title of host publicationProceedings, Annual Technical Conference - Society of Vacuum Coaters
Pages114-119
Number of pages6
StatePublished - 2003
Event46th Annual Technical Conference Proceedings - San Francisco, CA, United States
Duration: May 3 2003May 8 2003

Other

Other46th Annual Technical Conference Proceedings
CountryUnited States
CitySan Francisco, CA
Period5/3/035/8/03

Keywords

  • Dielectrics
  • Pulse bias
  • Pulse power
  • Reactive sputtering

ASJC Scopus subject areas

  • Mechanical Engineering
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Surfaces, Coatings and Films

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  • Cite this

    Freilich, A., Belkind, A., Becker, K., & Lopez, J. (2003). Substrate Biasing in Pulsed DC Reactive Sputtering of Dielectrics. In Proceedings, Annual Technical Conference - Society of Vacuum Coaters (pp. 114-119)