Thermal-Awareness in a Soft Error Tolerant Architecture

Sajjad Hussain, Muhammad Shafique, Jörg Henkel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It is crucial to provide soft error reliability in a power-efficient manner such that the maximum chip temperature remains within the safe operating limits. Different execution phases of an application have diverse performance, power, temperature and vulnerability behavior that can be leveraged to fulfill the resiliency requirements within the allowed thermal constraints. We propose a soft error tolerant architecture with fine-grained redundancy for different architectural components, such that their reliable operations can be activated selectively at fine-granularity to maximize the reliability under a given thermal constraint. When compared with state-of-the-art, our temperature-aware fine-grained reliability manager provides up to 30% reliability within the thermal budget.

Original languageEnglish (US)
Title of host publicationProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1555-1558
Number of pages4
ISBN (Electronic)9783981926323
DOIs
StatePublished - May 14 2019
Event22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 - Florence, Italy
Duration: Mar 25 2019Mar 29 2019

Publication series

NameProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019

Conference

Conference22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
CountryItaly
CityFlorence
Period3/25/193/29/19

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Control and Optimization

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