TY - GEN
T1 - Thermal constrained resource management for mixed ILP-TLP workloads in dark silicon chIPs
AU - Khdr, Heba
AU - Pagani, Santiago
AU - Shafique, Muhammad
AU - Henkel, Jörg
N1 - Publisher Copyright:
© 2015 ACM.
Copyright:
Copyright 2015 Elsevier B.V., All rights reserved.
PY - 2015/7/24
Y1 - 2015/7/24
N2 - In dark silicon chIPs, a significant amount of on-chIP resources cannot be simultaneously powered on and need to stay dark, i.e., power gated, in order to avoid thermal emergencies. This paper presents a resource management technique, called DsRem, that selects the number of active cores jointly with their voltage/frequency (v/f) levels, considering the high Instruction Level Parallelism (ILP) or Thread Level Parallelism (TLP) nature of different applications, in order to maximize the overall system performance. DsRem leverages the positioning of dark cores, to efficiently dissIPate the heat generated by the active cores. This facilitates increasing the v/f level of the active cores, which leads to further performance improvement. Compared to state-of-the-art thermal-aware task application mapping, DsRem achieves up to 46% performance gain, while avoiding any thermal emergencies. Additionally, DsRem outperforms the boosting technique with 26%.
AB - In dark silicon chIPs, a significant amount of on-chIP resources cannot be simultaneously powered on and need to stay dark, i.e., power gated, in order to avoid thermal emergencies. This paper presents a resource management technique, called DsRem, that selects the number of active cores jointly with their voltage/frequency (v/f) levels, considering the high Instruction Level Parallelism (ILP) or Thread Level Parallelism (TLP) nature of different applications, in order to maximize the overall system performance. DsRem leverages the positioning of dark cores, to efficiently dissIPate the heat generated by the active cores. This facilitates increasing the v/f level of the active cores, which leads to further performance improvement. Compared to state-of-the-art thermal-aware task application mapping, DsRem achieves up to 46% performance gain, while avoiding any thermal emergencies. Additionally, DsRem outperforms the boosting technique with 26%.
UR - http://www.scopus.com/inward/record.url?scp=84944128141&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84944128141&partnerID=8YFLogxK
U2 - 10.1145/2744769.2744916
DO - 10.1145/2744769.2744916
M3 - Conference contribution
AN - SCOPUS:84944128141
T3 - Proceedings - Design Automation Conference
BT - 2015 52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015
Y2 - 8 June 2015 through 12 June 2015
ER -