Towards performance and reliability-efficient computing in the dark silicon era

Jörg Henkel, Santiago Pagani, Heba Khdr, Florian Kriebel, Semeen Rehman, Muhammad Shafique

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper discusses the power density and temperature induced issues in modern on-chip systems due to the high integration density and roadblock on the voltage scaling. First, the emerging dark silicon problem is discussed, and the corresponding critical research challenges in future chips are enumerated. Afterwards, we present an overview of some key research efforts and concepts that leverage dark silicon for performance and reliability optimization of on-chip systems under power or temperature constraints. The summarized works account for heat transfer inside a chip, as well as the varying performance and power trade-offs of gray silicon, that is, the potential benefits of operating at lower-than-nominal voltage and frequency levels. Besides realizing reliability-heterogeneous architectures, reliability of an on-chip system is enhanced by exploiting dark silicon for aging deceleration and resilience-driven resource management to mitigate soft-errors. Several of the tools discussed in this paper are available for download at http://ces.itec.kit.edu/download.

Original languageEnglish (US)
Title of host publicationProceedings of the 2016 Design, Automation and Test in Europe Conference and Exhibition, DATE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
ISBN (Electronic)9783981537062
DOIs
StatePublished - Apr 25 2016
Event19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016 - Dresden, Germany
Duration: Mar 14 2016Mar 18 2016

Publication series

NameProceedings of the 2016 Design, Automation and Test in Europe Conference and Exhibition, DATE 2016

Other

Other19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016
CountryGermany
CityDresden
Period3/14/163/18/16

ASJC Scopus subject areas

  • Hardware and Architecture
  • Safety, Risk, Reliability and Quality

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