Transient phenomena in bridged local area networks

Cem Ersoy, Shivendra S. Panwar, Robert Dalias, Dror Segal

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The transient behavior of the bridged LAN (local area network) following failures is described. It is noted that, in the presence of an intermittent failure, the bridged LAN may experience high transient traffic periods called storms as well as virtual-circuit disconnects. In most cases observed, storms last less than a hello time. The peak traffic on the LAN during the storm is proportional to the peak forwarding rates of the bridges connected to the LAN. Some storms may not remain as local problems but propagate towards other parts of the network. The presence of separate RDB (routing database) tables for each port increases the probability of virtual-circuit disconnects. Some virtual-circuit disconnect problems can be prevented by setting certain time-out values appropriately, but this solution has the disadvantage of masking component failures from the network manager. Other means to detect and reduce the frequency of storms and virtual-circuit disconnects are also suggested. These point to a need for better network management tools for bridged LANs.

Original languageEnglish (US)
Title of host publicationGLOBECOM '90
PublisherPubl by IEEE
Pages1405-1409
Number of pages5
ISBN (Print)0879426322
StatePublished - 1990
EventIEEE Global Telecommunications Conference & Exhibition Part 3 (of 3) - San Diego, CA, USA
Duration: Dec 2 1990Dec 5 1990

Publication series

NameIEEE Global Telecommunications Conference and Exhibition
Volume3

Other

OtherIEEE Global Telecommunications Conference & Exhibition Part 3 (of 3)
CitySan Diego, CA, USA
Period12/2/9012/5/90

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Ersoy, C., Panwar, S. S., Dalias, R., & Segal, D. (1990). Transient phenomena in bridged local area networks. In GLOBECOM '90 (pp. 1405-1409). (IEEE Global Telecommunications Conference and Exhibition; Vol. 3). Publ by IEEE.