TY - GEN
T1 - Ultra-hard diamene films on silicon carbide for mechanical applications
AU - Cellini, Filippo
AU - Lavini, Francesco
AU - Riedo, Elisa
PY - 2019
Y1 - 2019
N2 - Similarly to graphite, atomically thin graphene films are known to be extremely flexible, exhibit a large in-plane stiffness (~1TPa), and be quite soft in the direction perpendicular to the graphene layers (~30 GPa). However, contrary to expectations, we found that at room temperature under pressure an epitaxial graphene film composed of buffer layer plus one graphene layer on SiC(0001) behaves at the nanoscale as a diamond-hard coating, which we named diamene. This ultra-thin and ultra-hard film exhibits exceptional mechanical responses to nano-indentation, equal, or even superior, to those of a CVD diamond film. Here, we review recent advancements in the study of diamene films, towards implementation of diamene coatings in current state-of-the-art mechanical technologies.
AB - Similarly to graphite, atomically thin graphene films are known to be extremely flexible, exhibit a large in-plane stiffness (~1TPa), and be quite soft in the direction perpendicular to the graphene layers (~30 GPa). However, contrary to expectations, we found that at room temperature under pressure an epitaxial graphene film composed of buffer layer plus one graphene layer on SiC(0001) behaves at the nanoscale as a diamond-hard coating, which we named diamene. This ultra-thin and ultra-hard film exhibits exceptional mechanical responses to nano-indentation, equal, or even superior, to those of a CVD diamond film. Here, we review recent advancements in the study of diamene films, towards implementation of diamene coatings in current state-of-the-art mechanical technologies.
UR - http://www.scopus.com/inward/record.url?scp=85068790049&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068790049&partnerID=8YFLogxK
U2 - 10.33599/nasampe/s.19.1494
DO - 10.33599/nasampe/s.19.1494
M3 - Conference contribution
AN - SCOPUS:85068790049
T3 - International SAMPE Technical Conference
BT - SAMPE Conference and Exhibition
A2 - Ahlstrom, Kevin
A2 - Anderson, Jacob Preston
A2 - Beckwith, Scott
A2 - Becnel, Andrew Craig
A2 - Biermann, Paul Joseph
A2 - Buchholz, Matt
A2 - Cates, Elizabeth
A2 - Gardner, Brian
A2 - Harris, Jim
A2 - Knight, Michael J.
A2 - Reyes-Villanueva, German
A2 - Scarborough, Stephen E.
A2 - Sears, Phil
A2 - Thomas, James
A2 - Thostenson, Erik T.
PB - Soc. for the Advancement of Material and Process Engineering
T2 - SAMPE 2019 Conference and Exhibition
Y2 - 20 May 2019 through 23 May 2019
ER -