Ultra-hard diamene films on silicon carbide for mechanical applications

Filippo Cellini, Francesco Lavini, Elisa Riedo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Similarly to graphite, atomically thin graphene films are known to be extremely flexible, exhibit a large in-plane stiffness (~1TPa), and be quite soft in the direction perpendicular to the graphene layers (~30 GPa). However, contrary to expectations, we found that at room temperature under pressure an epitaxial graphene film composed of buffer layer plus one graphene layer on SiC(0001) behaves at the nanoscale as a diamond-hard coating, which we named diamene. This ultra-thin and ultra-hard film exhibits exceptional mechanical responses to nano-indentation, equal, or even superior, to those of a CVD diamond film. Here, we review recent advancements in the study of diamene films, towards implementation of diamene coatings in current state-of-the-art mechanical technologies.

Original languageEnglish (US)
Title of host publicationSAMPE Conference and Exhibition
EditorsKevin Ahlstrom, Jacob Preston Anderson, Scott Beckwith, Andrew Craig Becnel, Paul Joseph Biermann, Matt Buchholz, Elizabeth Cates, Brian Gardner, Jim Harris, Michael J. Knight, German Reyes-Villanueva, Stephen E. Scarborough, Phil Sears, James Thomas, Erik T. Thostenson
PublisherSoc. for the Advancement of Material and Process Engineering
ISBN (Electronic)9781934551301
DOIs
StatePublished - 2019
EventSAMPE 2019 Conference and Exhibition - Charlotte, United States
Duration: May 20 2019May 23 2019

Publication series

NameInternational SAMPE Technical Conference
Volume2019-May

Conference

ConferenceSAMPE 2019 Conference and Exhibition
CountryUnited States
CityCharlotte
Period5/20/195/23/19

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Cellini, F., Lavini, F., & Riedo, E. (2019). Ultra-hard diamene films on silicon carbide for mechanical applications. In K. Ahlstrom, J. P. Anderson, S. Beckwith, A. C. Becnel, P. J. Biermann, M. Buchholz, E. Cates, B. Gardner, J. Harris, M. J. Knight, G. Reyes-Villanueva, S. E. Scarborough, P. Sears, J. Thomas, & E. T. Thostenson (Eds.), SAMPE Conference and Exhibition (International SAMPE Technical Conference; Vol. 2019-May). Soc. for the Advancement of Material and Process Engineering. https://doi.org/10.33599/nasampe/s.19.1494