Ultrasonic characterization of bond line parameters in adhesively bonded carbon-epoxy composites

Phani S. Mylavarapu, E. Woldesenbet, Nikhil Gupta, A. Davis, G. Li

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	Proceedings of the American Society for Composites 19th Annual Technical Conference, Atlanta, GA, October 17-20, 2004
State	Published - 2004

Cite this

Mylavarapu, P. S., Woldesenbet, E., Gupta, N., Davis, A., & Li, G. (2004). Ultrasonic characterization of bond line parameters in adhesively bonded carbon-epoxy composites. In Proceedings of the American Society for Composites 19th Annual Technical Conference, Atlanta, GA, October 17-20, 2004 [Paper #NE2]

Proceedings of the American Society for Composites 19th Annual Technical Conference, Atlanta, GA, October 17-20, 2004. 2004. Paper #NE2.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

@inproceedings{0751311918264edbbbf24c6d48ba6034,

title = "Ultrasonic characterization of bond line parameters in adhesively bonded carbon-epoxy composites",

author = "Mylavarapu, {Phani S.} and E. Woldesenbet and Nikhil Gupta and A. Davis and G. Li",

year = "2004",

language = "English (US)",

booktitle = "Proceedings of the American Society for Composites 19th Annual Technical Conference, Atlanta, GA, October 17-20, 2004",

}

TY - GEN

T1 - Ultrasonic characterization of bond line parameters in adhesively bonded carbon-epoxy composites

AU - Mylavarapu, Phani S.

AU - Woldesenbet, E.

AU - Gupta, Nikhil

AU - Davis, A.

AU - Li, G.

PY - 2004

Y1 - 2004

M3 - Conference contribution

BT - Proceedings of the American Society for Composites 19th Annual Technical Conference, Atlanta, GA, October 17-20, 2004

ER -