TY - GEN
T1 - Variability-aware dark silicon management in on-chip many-core systems
AU - Shafique, Muhammad
AU - Gnad, Dennis
AU - Garg, Siddharth
AU - Henkel, Jorg
N1 - Publisher Copyright:
© 2015 EDAA.
PY - 2015/4/22
Y1 - 2015/4/22
N2 - Dark Silicon refers to the constraint that only a fraction of on-chip resources (cores) can be simultaneously powered-on (running at full performance) in order to stay within the allowable power budget and safe temperature limits, while others remain 'dark'. In this paper, we demonstrate how these 'dark cores' can be leveraged to improve the temperature profile at run-time, thus providing opportunities to power-on more cores at the nominal voltage than the number allowed when strictly obeying the conventional Thermal Design Power (TDP) constraint. In this paper, we propose a computationally efficient dark silicon management technique that determines the best set of cores to keep dark and the mapping of threads to cores at run-time, while also accounting for the impact of process variations. We have developed a lightweight temperature prediction mechanism that determines the impact of different candidate solutions on the chip thermal profile. Experimental evaluation of the proposed techniques on a simulated 8×8 many-core processor, and across a range of chips to account for process variations, show that the total instruction throughput is increased by 1.8× on average while keeping the temperature within the safe limits, when compared with state-of-the-art approaches.
AB - Dark Silicon refers to the constraint that only a fraction of on-chip resources (cores) can be simultaneously powered-on (running at full performance) in order to stay within the allowable power budget and safe temperature limits, while others remain 'dark'. In this paper, we demonstrate how these 'dark cores' can be leveraged to improve the temperature profile at run-time, thus providing opportunities to power-on more cores at the nominal voltage than the number allowed when strictly obeying the conventional Thermal Design Power (TDP) constraint. In this paper, we propose a computationally efficient dark silicon management technique that determines the best set of cores to keep dark and the mapping of threads to cores at run-time, while also accounting for the impact of process variations. We have developed a lightweight temperature prediction mechanism that determines the impact of different candidate solutions on the chip thermal profile. Experimental evaluation of the proposed techniques on a simulated 8×8 many-core processor, and across a range of chips to account for process variations, show that the total instruction throughput is increased by 1.8× on average while keeping the temperature within the safe limits, when compared with state-of-the-art approaches.
UR - http://www.scopus.com/inward/record.url?scp=84945948269&partnerID=8YFLogxK
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U2 - 10.7873/date.2015.0900
DO - 10.7873/date.2015.0900
M3 - Conference contribution
AN - SCOPUS:84945948269
T3 - Proceedings -Design, Automation and Test in Europe, DATE
SP - 387
EP - 392
BT - Proceedings of the 2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015
Y2 - 9 March 2015 through 13 March 2015
ER -